Testing apparatus for data storage devices

ABSTRACT

A testing apparatus for Data Storage Devices (DSDs) includes a chassis and at least one interface module configured to be removably inserted into the chassis and house a plurality of interface boards. Each interface board includes a DSD connector for connecting a DSD to the interface board and a backplane connector for connecting to a backplane for communicating with a respective computing unit. In one aspect, the at least one interface module includes a housing and a plurality of openings in a side of the housing with each opening configured to receive a respective interface board. A plurality of guide member pairs is positioned to guide respective interface boards when inserted into respective openings such that the backplane connector is located at a respective predetermined location for connecting to the backplane. In another aspect, the interface boards are removable from the interface module.

CROSS-REFERENCE TO RELATED APPLICATION

This application is related to U.S. application Ser. No. 17/412,889titled “TESTING APPARATUS FOR TEMPERATURE TESTING OF ELECTRONICDEVICES”, filed on Aug. 26, 2021, which is hereby incorporated byreference in its entirety.

BACKGROUND

Manufacturers of Data Storage Devices (DSDs), such as Solid State Drives(SSDs), often test the DSDs before leaving the factory to ensure qualitycontrol in terms of data retention or operating performance, forexample. In some cases, many DSDs may be simultaneously tested inside atesting apparatus. However, there are many different form factors ofSSDs, such as U.2 15 mm, U.2 7 mm, E3, M.2, and EDSFF, which each havedifferent physical sizes and different connectors for the differenttypes of DSDs. Testing for these different form factors typicallyrequires dismantling the testing apparatus and replacing components suchas a new backplane to accommodate the different form factors, or usingdedicated testing apparatuses for each form factor. Even in cases wherea dedicated testing apparatus is used for a particular form factor,accessing the DSDs to replace them with other DSDs to be tested can bedifficult. In addition, backplanes that use a Peripheral ComponentInterconnect express (PCIe) bus can suffer in terms of data errors fromhaving wire runs, which are often used in temperature controlled testingapparatuses to thermally isolate the DSDs from the backplane and testingcomputers connected to the DSDs.

BRIEF DESCRIPTION OF THE DRAWINGS

The features and advantages of the embodiments of the present disclosurewill become more apparent from the detailed description set forth belowwhen taken in conjunction with the drawings. The drawings and theassociated descriptions are provided to illustrate embodiments of thedisclosure and not to limit the scope of what is claimed.

FIG. 1 is a front perspective view of an exterior of a testing apparatusaccording to one or more embodiments.

FIG. 2 is a front view of the testing apparatus of FIG. 1 with certaininterior components exposed according to one or more embodiments.

FIG. 3 is a front perspective view of an interface module according toone or more embodiments.

FIG. 4 is a front perspective view of an interface module housing DataStorage Devices (DSDs) and interface boards according to one or moreembodiments.

FIG. 5 depicts interface boards connected to DSDs having different formfactors according to one or more embodiments.

FIG. 6 depicts front views of interface modules used for DSDs havingdifferent form factors according to one or more embodiments.

FIG. 7 is a front perspective view of the interface modules of FIG. 6when housing DSDs and interface boards according to one or moreembodiments.

FIG. 8 is a rear perspective of a testing apparatus depicting aremovable computing module before complete insertion into or completeremoval from the testing apparatus according to one or more embodiments.

FIG. 9 is a rear perspective of a removable computing module accordingto one or more embodiments.

DETAILED DESCRIPTION

In the following detailed description, numerous specific details are setforth to provide a full understanding of the present disclosure. It willbe apparent, however, to one of ordinary skill in the art that thevarious embodiments disclosed may be practiced without some of thesespecific details. In other instances, well-known structures andtechniques have not been shown in detail to avoid unnecessarilyobscuring the various embodiments.

FIG. 1 is a front perspective view of an exterior of testing apparatus100 according to one or more embodiments. Testing apparatus 100 is usedto test Data Storage Devices (DSDs), which may also be referred toherein as Devices Under Test (DUTs). In some implementations, testingapparatus 100 can be used, for example, to test DSDs, such as SolidState Drives (SSDs). The testing can be performed by, for example, amanufacturer as part of a quality control process or to test performancecapabilities of the DSDs at different temperatures, such as dataretention or to determine safe temperature operating limits. Suchtemperature controlled testing is described in further detail inapplication Ser. No. 17/412,889, which is incorporated by referenceabove.

As shown in FIG. 1 , testing apparatus 100 rests on surface 10, whichmay be a floor or other substantially horizontal surface (e.g., within 5degrees of a ground plane) for supporting testing apparatus 100. As usedherein, horizontal or substantially horizontal can refer to a plane thatis parallel or substantially parallel (e.g., within 5 degrees) to asurface upon which testing apparatus 100 rests (i.e., surface 10).Testing apparatus 100 includes door 104 that provides access to aninterior chamber or space (e.g., chamber 140 in FIG. 2 ) within chassis106 that can receive the DSDs to be tested. Door 104 includes intakevents 108 _(A) and 108 _(B) for drawing in a fluid, such as air, from anexterior of testing apparatus 100 to cool the DSDs inside testingapparatus 100.

In the example of FIG. 1 , testing apparatus 100 includes exhaust hood102 for exhausting fluid from testing apparatus 100. In someimplementations, the amount of fluid exhausted from testing apparatus100 is controlled to adjust the relative amounts of fluid drawn into thechamber and recirculated or recycled within the chamber to reach ormaintain a target temperature in the chamber. In other implementations,exhaust hood 102 may be omitted, such as by exhausting the fluid fromtesting apparatus 100 to an ambient exterior of testing apparatus 100,as opposed to directing the exhausted fluid to a vent.

As will be appreciated by those of ordinary skill in the art withreference to the present disclosure, other implementations of testingapparatus 100 can include a different arrangement or number ofcomponents than shown in the example of FIG. 1 . For example, otherimplementations may include a different number of intake vents 108 or adifferent footprint of testing apparatus 100, such that testingapparatus 100 may be a bench-mounted testing apparatus.

FIG. 2 is a front view of the testing apparatus of FIG. 1 with door 104removed to show certain interior components according to one or moreembodiments. As shown in FIG. 2 , interface modules 110 ₁, 110 ₂, 110 ₃,110 ₄, 110 ₅, 110 ₆, 110 ₇, and 110 ₈ are located inside chamber 140within chassis 106 of testing apparatus 100. Each interface module 110in the example of FIG. 2 houses sixteen DSDs, which may be removed andinserted into openings in the front of the interface module 110. TheDSDs are arranged in horizontal or substantially horizontal rows withrespect to surface 10. Each horizontal row in an interface module 110includes two DSDs. In addition, each interface module 110 housesinterface boards (e.g., interface boards 122 in FIGS. 4, 5, and 7 ) thatare in line with the openings that receive the DSDs. The interfacemodules 110 themselves, with or without the DSDs and interface boards,may be removed and inserted into chamber 140 into any one of the eightdifferent locations shown in chamber 140.

Those of ordinary skill in the art will appreciate that otherimplementations may include a different arrangement for the interior oftesting apparatus 100. For example, other implementations may include adifferent number of interface modules or a different number of DSDs perinterface module than shown in FIG. 2 .

FIG. 3 is a front perspective view of an empty interface module withoutany DSDs or interface boards according to one or more embodiments. Asshown in FIG. 3 , interface module 110 ₁ includes sixteen openings, suchas openings 112 ₁ and 112 ₂, in a front side of interface module 110 ₁.The openings 112 ₁ and 112 ₂ are arranged in a top horizontal orsubstantially horizontal row. Each opening in the front side ofinterface module 110 ₁ can receive an interface board and a DSD. Notches116 _(1A) and 116 _(1B) provide a support for holding or securing a DSDin place in opening 112 ₁. Notches 116 _(2A) and 116 _(2B) provide asupport for holding or securing a DSD in place in opening 112 ₂. Thenotches 116 may work in conjunction with locking tabs or another lockingmechanism that may form part of an interface board, such as locking tabs124 shown in FIG. 5 . Other implementations may use different lockingmechanisms, such as a locking clip or rotating lock, for example.

Each opening also corresponds to a pair of guide members, such as guidemembers 118 _(2A) and 118 _(2B), positioned to guide an interface boardinserted through the opening so that a backplane connector (e.g.,backplane connectors 123 in FIG. 5 ) of the interface board is locatedat a predetermined location with respect to chassis 106 of testingapparatus 100 and with respect to housing 126 ₁ of interface module 110₁ for connecting to a backplane (e.g., backplane 136 in FIGS. 8A and8B). In the example of FIG. 3 , the backplane connectors are configuredto protrude from a rear opening, such as rear opening 120 ₂, forconnection to the backplane.

Handles 114 ₁ and 114 ₂ can facilitate insertion and removal ofinterface module 110 ₁ into and from the testing apparatus. In thisregard, the first space or chamber of the testing apparatus can includeshelves or slats for receiving interface module 110 ₁ and holding it inplace inside chamber 140. The interface modules 110 may also beinterchangeable among different testing apparatuses, such as testingapparatus 100. In the implementation of FIG. 3 , handles 114 areremovable, but other implementations may include non-removable handlesor a different number of handles.

Those of ordinary skill in the art will appreciate that otherimplementations of interface module 110 ₁ may differ. For example,interface module 110 ₁ may include a mix of different sized openings forreceiving DSDs with different form factors, differently sized openingson the rear of interface module 110 ₁, or no openings on the sides ofinterface module 110 ₁.

FIG. 4 is a front perspective view of interface module 110 ₂ housingDSDs and interface boards inside of housing 126 ₂ according to one ormore embodiments. As shown in FIG. 2 , interface module 110 ₂ includeseight horizontal or substantially horizontal rows of DSDs, such as DSD201 and 202, which have been inserted into openings 112 ₃ and 112 ₄,respectively, to be partially housed in a respective bay of interfacemodule 110 ₂. Each DSD connects to an interface board via a DSDconnector of the interface board (not shown). In the example of DSD 202,interface board 122 ₂ removably connects to DSD 202, and backplaneconnector 123 ₂ of interface board 122 ₂ is accessible via opening 120 ₄in a rear side of interface module 110 ₂ opposite front openings 112.

As with interface module 110 ₁ discussed above, the interface boards andDSDs shown in FIG. 4 are removable from interface module 110 ₂. In thisregard, the interface boards are supported and guided into apredetermined position using pairs of guide members on opposite sides ofeach opening. Guide member 118 ₄ is shown in FIG. 4 and is used tosupport and guide interface board 122 ₂.

In the example of FIG. 4 , interface module 110 ₂ and the interfaceboards are configured so that each interface board can be inserted intoany one of the front openings. Similarly, each DSD in the example ofFIG. 4 can be partially inserted into any one of the front openings toconnect with any one of the interface boards previously inserted intointerface module 110 ₂. This interchangeability of DSDs can reduce thetesting time for a large number of DSDs in the testing apparatus sincethe DSDs can be conveniently inserted into the front openings of thetesting apparatus and removed when testing is finished, before replacingthe DSD with a new DSD to be tested. In some cases, the entire interfacemodule 110 ₂ may be swapped out with a different interface module thatmay already include interface boards and/or DSDs to be tested. In thisregard, handles 114 ₃ and 114 ₄ may be used to remove or insertinterface module 110 ₂ from or into the testing apparatus chamber.

As discussed in more detail below, interface module 110 ₂ may also becapable of accommodating a variety of different form factors with thereplacement of the interface boards in housing 126 ₂. In someimplementations, the front openings may be different sizes toaccommodate different form factors or may all be the same size as shownin FIG. 4 , which may also be able to accommodate different formfactors. Those of ordinary skill in the art will appreciate thatinterface module 110 ₂, the DSDs and interface boards may have adifferent arrangement or configuration than shown in FIG. 4 . Forexample, other implementations may not include openings on the side ofinterface module 110 ₂ or may include a different number of frontopenings.

FIG. 5 depicts interface boards connected to DSDs having different formfactors according to one or more embodiments. Each DSD in FIG. 5 has adifferent form factor and a different corresponding interface board. DSD20 ₃ has a U.2 15 mm form factor, DSD 20 ₄ has an E3 form factor, DSD 20₅ has an M.2 form factor, DSD 20 ₆ has an EDSFF form factor, and DSD 20₇ has a U.2 7 mm form factor. As will be appreciated by those ofordinary skill with reference to the present disclosure, other formfactors and corresponding interface boards may be used than those shownin FIG. 5 .

In addition to having different physical dimensions, each DSD in FIG. 5uses a different type of connection to its respective interface board.In this regard, interface board 122 ₁ for DSD 20 ₃ uses DSD connector125 ₁, interface board 122 ₂ for DSD 20 ₄ uses DSD connector 125 ₂,interface board 122 ₃ for DSD 20 ₅ uses DSD connector 125 ₃, interfaceboard 122 ₄ for DSD 20 ₆ uses DSD connector 125 ₄, and interface board122 ₅ for DSD 20 ₇ uses DSD connector 125 ₅.

Backplane connectors 123 ₁, 123 ₂, 123 ₃, 123 ₄, and 123 ₅ of interfaceboards 122 ₁, 122 ₂, 122 ₃, 122 ₄, and 122 ₅, respectively, utilize thesame Peripheral Component Interconnect express (PCIe) connectors for auniform backplane connection. This standardization on one backplaneconnector type, such as PCIe, can facilitate the interchangeability ofthe different types of interface boards into different slots or bays ofthe interface modules. In addition to having different DSD connectortypes, the interface boards 122 in FIG. 5 also have different physicalshapes to accommodate the differently sized types of DSDs.

Each interface board 122 in FIG. 5 also includes a DSD support with alocking mechanism to stabilize or hold the DSD in an opening of aninterface module. In the example of FIG. 5 , DSD supports 127 ₁, 127 ₂,127 ₃, 127 ₄, and 127 ₅ hold DSDs 20 ₃, 20 ₄, 20 ₅, 20 ₆, and 20 ₇ inplace in openings, such as openings 112 ₁ and 112 ₂ in FIG. 3 andopenings 112 ₃ and 112 ₄ in FIG. 4 . In addition, locking tabs 124 ₁,124 ₂, 124 ₃, 124 ₄, and 124 ₅ can lock or secure DSDs 20 ₃, 20 ₄, 20 ₅,20 ₆, and 20 ₇ into their respective openings. The pairs of locking tabs124 for each DSD can lock into notches, such as notches 116 of interfacemodule 110 ₁ in FIG. 3 , to secure the DSDs into the openings.

Those of ordinary skill in the art will appreciate that other lockingmechanisms or interface boards may be used in other implementations. Forexample, other interface boards may have a different shape or DSDsupport to accommodate a different form factor.

FIG. 6 depicts front views of interface modules used for DSDs havingdifferent form factors according to one or more embodiments. As shown inFIG. 6 , interface modules 110 ₃ and 110 ₁ include front openings inhousings 126 ₃ and 126 ₁, respectively. Openings 112 ₅ and 112 ₆ ininterface module 110 ₃ and openings 112 ₁ and 112 ₂ in interface module110 ₁ have slightly different sizes to accommodate different formfactors or types of DSDs. In addition, the relative locations of thenotches with respect to the front openings in interface module 110 ₃,such as notches 116 _(3A), 116 _(3B), 116 _(4A), and 116 _(4B), differsfrom the relative locations of the notches with respect to the frontopenings in interface module 110 ₁, such as notches 116 _(1A), 116_(1B), 116 _(2A), and 116 _(2B). The locations of guide members withininterface modules 110 ₃ and 110 ₁ (e.g., guide member 118 _(2B)) mayalso differ to accommodate DSDs having different form factors, such asby being located more towards a halfway height of the front openings, asopposed to being located below a halfway height, as with the case of thenotches in interface module 110 ₁. As with handles 114 ₁ and 114 ₂ ofinterface module 110 ₁, handles 114 ₅ and 114 ₆ facilitate insertion andremoval of interface module 110 ₃ into and from a testing apparatus.

FIG. 7 is a front perspective view of the interface modules of FIG. 6when housing DSDs and interface boards according to one or moreembodiments. As shown in FIG. 7 , interface module 110 ₃ houses threedifferent types of DSDs having different form factors and interfacemodule 110 ₁ houses four different types of DSDs having different formfactors. In this regard, interface module 110 ₃ can house both DSD 20 ₆and DSD 20 ₅ due in part to the different interface boards, such asinterface board 122 ₃. In the example of FIG. 7 , DSD 20 ₆ is held inplace in interface module 110 ₃ with the use of DSD support 127 ₄ andlocking tabs 124 ₄ of interface board 122 ₄ shown in FIG. 5 . Similarly,DSD 20 ₅ is held in place in interface module 110 ₃ with the use of DSDsupport 127 ₃ and locking tabs 124 ₃ of interface board 122 ₃.

With respect to interface module 110 ₁, DSD 20 ₃ is secured intointerface module 110 ₁ with DSD support 127 ₁ and locking tabs 124 ₁.DSD 20 ₄ is secured into interface module 110 ₁ with DSD support 127 ₁and locking tabs 124 ₁, and DSD 20 ₄ is secured into interface module110 ₁ with DSD support 127 ₂ and locking tabs 124 ₂. As shown in FIG. 7, interface boards 122 ₅ and 122 ₂ are used to connect communicationswith DSDs 20 ₇ and 20 ₄, respectively. The interchangeability of DSDshaving different form factors and corresponding interface boards thatcan be used with an interface module can allow for the simultaneoustesting of DSDs having different form factors. The only changes neededto switch from one form factor to another for a given opening in theinterface module is to change the interface board. This arrangementallows for more flexibility in the equipment used for testing DSDs.

FIG. 8 is a rear perspective of testing apparatus 100 depictingremovable computing module 128 ₁ before complete insertion into orcomplete removal from testing apparatus 100 according to one or moreembodiments. As shown in FIG. 8 , removable computing module 128 ₁ ispart of a rear portion or rear space of testing apparatus 100 that islocated behind the testing chamber or front space that houses interfacemodules. For its part, removable computing module 128 ₁ houses one ormore computing units, which may include, for example, processingcircuitry, such as one or more Central Processing Units (CPUs),Field-Programmable Gate Arrays (FPGAs), Application-Specific IntegratedCircuits (ASICs), or Graphics Processing Units (GPUs), that have beenprogrammed to run tests on DSDs in a testing chamber of the testingapparatus.

In the example of FIG. 8 , removable computing unit 128 ₁ corresponds toan interface module in chamber 140 accessed via door 104 from the frontof testing apparatus 100. Removable computing unit 128 ₁ may abut acorresponding interface module or be on an opposite side of a wallbetween the corresponding interface module and the removable computingunit 128 ₁ to allow for a direct connection between interface boardsinside the corresponding interface module and a backplane of removablecomputing module 128 ₁ (i.e., backplane 136 shown in FIG. 9 ).

In this regard, each of removable computing modules 128 ₁, 128 ₂, 128 ₅and 128 ₆ shown in FIG. 8 can correspond to a respective interfacemodule in chamber 140 accessed via door 104 from the front of testingapparatus 100. The removable computing modules 128 can be removed fromand inserted into any one of the different locations using, for example,guide rails in testing apparatus 100. The removable computing modules128 may be further secured to testing apparatus 100 in someimplementations using screws or other locking mechanisms. Theinterchangeability of computing modules 128 in testing apparatus 100 canfacilitate changes to be made to the computing unit or computing unitsin the removable computing module 128 before reinserting the computingmodule 128 into its previous location or before swapping the computingmodule with a different removable computing module 128.

FIG. 9 is a rear perspective of removable computing module 128 ₁according to one or more embodiments. As shown in FIG. 9 , removablecomputing module 128 ₁ includes backplane 136 and thermal isolation wall134. The computing unit of removable computing module 128 ₁ directlyconnects to backplane 136, which in turn, directly connects to interfaceboards inside the corresponding interface module in chamber 140.

In the example of FIG. 9 , a computing unit, which may be part of amotherboard, is separated from the testing chamber and its correspondinginterface module by thermal isolation wall 134, which provides a thermalbarrier between the testing chamber and test engine compartment 128. Asdiscussed in application Ser. No. 17/412,889 incorporated by referenceabove, the testing chamber may be temperature controlled to rundifferent tests at different temperatures or to ensure operation of theDSDs at a target temperature or at an approximate target temperature.

Backplane 136 allows for a wireless connection to the interface boardsin the testing chamber without compromising the thermal isolationprovided by thermal isolation wall 134. In contrast, conventionaltemperature testing apparatuses for DSDs typically use wires withgrommets surrounding the wires for communication with DSDs in atemperature-controlled testing chamber. However, bus standards such asPCIe may encounter noise-induced errors due to such wire runs. Thearrangement of backplane 136 on thermal isolation wall 134 can providefor direct connections with interface boards, which are in turn directlyconnected to the DSDs to avoid wire runs while still providing thermalisolation of the testing chamber.

As discussed above, the foregoing arrangements of removable interfacemodules and removable interface boards can facilitate the testing ofDSDs having different form factors using the same testing apparatus.This interchangeability can avoid complicated teardowns of testingequipment to accommodate different form factors. In addition, theinterface boards can allow for a wire-free connection to the backplaneand computing units, while still thermally isolating the DSDs from thecomputing units and backplane in a different compartment of the testingapparatus for better temperature control.

Other Embodiments

Those of ordinary skill in the art will appreciate that the variousillustrative logical blocks, modules, and processes described inconnection with the examples disclosed herein may be implemented aselectronic hardware, computer software, or combinations of both.Furthermore, the foregoing processes can be embodied on a computerreadable medium which causes processor or controller circuitry toperform or execute certain functions.

To clearly illustrate this interchangeability of hardware and software,various illustrative components, blocks, and modules have been describedabove generally in terms of their functionality. Whether suchfunctionality is implemented as hardware or software depends upon theparticular application and design constraints imposed on the overallsystem. Those of ordinary skill in the art may implement the describedfunctionality in varying ways for each particular application, but suchimplementation decisions should not be interpreted as causing adeparture from the scope of the present disclosure.

The various illustrative logical blocks, units, modules, processorcircuitry, and controller circuitry described in connection with theexamples disclosed herein may be implemented or performed with a generalpurpose processor, a GPU, a Digital Signal Processor (DSP), an ASIC, anFPGA or other programmable logic device, discrete gate or transistorlogic, discrete hardware components, or any combination thereof designedto perform the functions described herein. A general purpose processormay be a microprocessor, but in the alternative, the processor may beany conventional processor, controller, microcontroller, or statemachine. Processor or controller circuitry may also be implemented as acombination of computing devices, e.g., a combination of a DSP and amicroprocessor, a plurality of microprocessors, an SoC, one or moremicroprocessors in conjunction with a DSP core, or any other suchconfiguration.

The activities of a method or process described in connection with theexamples disclosed herein may be embodied directly in hardware, in asoftware module executed by processor or controller circuitry, or in acombination of the two. The steps of the method or algorithm may also beperformed in an alternate order from those provided in the examples. Asoftware module may reside in RAM memory, flash memory, ROM memory,EPROM memory, EEPROM memory, registers, hard disk, a removable media, anoptical media, or any other form of storage medium known in the art. Anexemplary storage medium is coupled to processor or controller circuitrysuch that the processor or controller circuitry can read informationfrom, and write information to, the storage medium. In the alternative,the storage medium may be integral to processor or controller circuitry.The processor or controller circuitry and the storage medium may residein an ASIC or an SoC.

The foregoing description of the disclosed example embodiments isprovided to enable any person of ordinary skill in the art to make oruse the embodiments in the present disclosure. Various modifications tothese examples will be readily apparent to those of ordinary skill inthe art, and the principles disclosed herein may be applied to otherexamples without departing from the spirit or scope of the presentdisclosure. The described embodiments are to be considered in allrespects only as illustrative and not restrictive. In addition, the useof language in the form of “at least one of A and B” in the followingclaims should be understood to mean “only A, only B, or both A and B.”

What is claimed is:
 1. A testing apparatus for testing Data StorageDevices (DSDs), the testing apparatus comprising: a chassis; and atleast one interface module configured to be removably inserted into thechassis and to house a plurality of interface boards, wherein eachinterface board of the plurality of interface boards includes a DSDconnector for connecting a DSD to the interface board and a backplaneconnector for directly connecting to a backplane for communicating witha respective computing unit.
 2. The testing apparatus of claim 1,wherein the at least one interface module includes a plurality ofopenings for receiving the plurality of interface boards, and whereinthe plurality of interface boards is removable from the at least oneinterface module such that each interface board of the plurality ofinterface boards is configured to be inserted into any one of theplurality of openings of the at least one interface module.
 3. Thetesting apparatus of claim 1, wherein the at least one interface moduleincludes a plurality of openings for receiving the plurality ofinterface boards and respective DSDs, and wherein the plurality ofopenings includes openings of different sizes for receiving DSDs havingdifferent form factors.
 4. The testing apparatus of claim 1, wherein thebackplane connectors of the plurality of interface boards are of thesame type and at least two of the DSD connectors of the plurality ofinterface boards are of different types from each other.
 5. The testingapparatus of claim 1, further comprising a computing module configuredto be removably inserted into the chassis and to house a plurality ofcomputing units, wherein each computing unit of the plurality ofcomputing units is configured to connect to the backplane.
 6. Thetesting apparatus of claim 1, wherein the at least one interface moduleincludes a plurality of first openings in a first side, each opening ofthe plurality of openings configured to receive a respective interfaceboard, and wherein the plurality of openings is arranged in at least onehorizontal row with respect to a surface upon which the testingapparatus rests.
 7. The testing apparatus of claim 1, wherein the atleast one interface module includes: a plurality of first openings in afirst side, each opening of the plurality of openings configured toreceive a respective interface board; and a plurality of guide memberpairs positioned to guide respective interface boards when received inrespective first openings of the plurality of first openings such that abackplane connector of the interface board is located at a predeterminedlocation with respect to the chassis for connecting to a backplane. 8.The testing apparatus of claim 1, further comprising a thermal isolationwall separating a first space within the chassis from the backplane, thefirst space configured to receive the at least one interface module. 9.An interface module of a testing apparatus for testing Data StorageDevices (DSDs), the interface module comprising: a housing; a pluralityof openings in a first side of the housing, each opening of theplurality of openings configured to receive a respective interfaceboard; and a plurality of guide member pairs positioned to guiderespective interface boards when inserted into respective openings ofthe plurality of openings such that a backplane connector of eachrespective interface board is located at a respective predeterminedlocation with respect to the housing for directly connecting to abackplane of the testing apparatus.
 10. The interface module of claim 9,wherein the respective interface boards are removable from the pluralityof openings such that each of the respective interface boards isconfigured to be inserted into any one of the plurality of openings. 11.The interface module of claim 9, wherein the plurality of openings arefurther configured to receive respective DSDs, and wherein the pluralityof openings includes openings of different sizes for receiving DSDshaving different form factors.
 12. The interface module of claim 9,wherein the respective interface boards further include a DSD connectorfor communicating with a DSD, and wherein the backplane connectors ofthe respective interface boards are of the same type and at least two ofthe DSD connectors of the respective interface boards are of differenttypes from each other.
 13. The interface module of claim 9, wherein theplurality of openings is arranged in at least one horizontal row withrespect to a surface upon which the testing apparatus rests.
 14. Theinterface module of claim 9, wherein the at least one interface moduleis configured to be removably inserted into a chassis of the testingapparatus.
 15. The interface module of claim 9, wherein the testingapparatus includes a thermal isolation wall separating the interfacemodule from the backplane.
 16. A testing apparatus for testing DataStorage Devices (DSDs), the testing apparatus comprising: a chassis;means for housing a plurality of removable interface boards in thechassis, wherein each removable interface board of the plurality ofremovable interface boards is configured to be removably inserted intothe means for housing the plurality of removable interface boards,wherein each removable interface board of the plurality of removableinterface boards includes a DSD connector for connecting to a DSD and abackplane connector for connecting to a backplane for communicating witha respective computing unit; and a thermal isolation wall separating afirst space within the chassis from the backplane, the first spaceconfigured to receive the means for housing the plurality of removableinterface boards.
 17. The testing apparatus of claim 16, wherein themeans for housing the plurality of removable interface boards isconfigured to be removably inserted into the chassis.
 18. The testingapparatus of claim 16, wherein the means for housing the plurality ofremovable interface boards is configured to guide respective removableinterface boards such that when the removable interface board isinserted into the means for housing the plurality of removable interfaceboards, the backplane connector of each respective removable interfaceboard is located at a respective predetermined location with respect tothe chassis for connecting to the backplane.
 19. The testing apparatusof claim 16, further comprising means for removably inserting aplurality of computing units into the chassis, housing a plurality ofcomputing units, wherein each computing unit of the plurality ofcomputing units is configured to connect to the backplane.
 20. Thetesting apparatus of claim 16, wherein the backplane connector of eachremovable interface board of the plurality of removable interface boardsis configured to directly connect to the backplane.